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Package Designer
Job Posted: 7 hours ago
Salary: £ 200 - 250 / Day
Job Type: Contract
Location: Cambridge, Cambridgeshire
Expire in: a month
Job Description
Looking for candidates with strong expertise in Substrate Design, Flip Chip Design, and Advanced Package Design.
JOB DESCRIPTION
Netlist creation, BGA creation as per the inputs
Conduct feasibility studies to advise optimum pad layout, interconnect types and substrate parameters for a specific IC device or application.
Define substrate stack-ups, routing strategies and via structures.
Substrate design experience for RF, digital, high-speed and mixed signal die
Excellent understanding of SI/PI requirement for routing HSIO (DDR, SERDES, etc).
Good experience in UCIE-Advanced and Standard technology, HBM technology.
Experience in setting design rule checks (DRC) to ensure layouts meet specific manufacturing, Assembly and design guidelines.
Experience of optimise the die breakout for signals and create patterns for High power.
Strong understanding of HDI substrate technologies, layout design rules, and materials for optimal performance. Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
Knowledge on different Package types.
Experience in Wire bond, Flip chip Substrate designs.
Hands on experience with Wire bond, Flip chip & advanced packaging technologies (2.5D, 3D, RDL, embedded passives, etc.)
Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWoS.
Knowledge of different OSAT design rules
QUALIFICATION :
Bachelor’s degree in Electronics /Electrical Engineering,
5+ years in IC package design and development.
Proficiency with Cadence Allegro Package DesignerBefore You Apply
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